BACK-END-OF-LINE (BEOL) 4H-SiC Silicon Carbide (SiC) Integrated Circuit Processing on 100 mm Diameter SiC Wafers
SAM.GOV Due: June 20, 2025 at 08:00 PM UTC
In-Active Presolicitation Source Url

Summary

The opportunity titled 'BACK-END-OF-LINE (BEOL) 4H-SiC Silicon Carbide (SiC) Integrated Circuit Processing on 100 mm Diameter SiC Wafers' is a presolicitation notice issued by NASA Glenn Research Center. This project involves the processing of silicon carbide integrated circuits, specifically focusing on the back-end-of-line operations for 100 mm diameter SiC wafers. Contractors with expertise in semiconductor processing, particularly those experienced in silicon carbide technology, are encouraged to bid on this opportunity. The work is expected to be performed in Cleveland, Ohio, and is aimed at enhancing capabilities in integrated circuit manufacturing for advanced applications.
Entities
NAASA
National Aeronautics and Space Administration
NAICS
541715
Set Aside
None
Place of Performance
Cleveland , Ohio 44135
Point of Contact
Full Name Email Phone Type
Claude David [email protected] primary
Eric Hartman [email protected] secondary