Embedded Electricity Regeneration RFI
SAM.GOV Due: May 26, 2025 at 05:00 PM UTC
In-Active Special Notice Source Url

Summary

The Embedded Electricity Regeneration RFI issued by the Defense Advanced Research Projects Agency (DARPA) seeks information on microsystems capable of converting dissipated heat into electricity at the chip, substrate, or package levels. This initiative aims to explore various microsystems, including graphics processing units, central processing units, and other relevant technologies, to demonstrate the feasibility of embedded heat-to-electricity conversion. Contractors with expertise in microsystem technology, particularly those involved in semiconductor design and manufacturing, are encouraged to respond. The RFI invites submissions that detail potential microsystems, associated intellectual property, and applications for the recovered electricity, with a focus on innovative solutions that could transform power infrastructure in both commercial and defense sectors.
Description
The Defense Advanced Research Projects Agency (DARPA) Microsystems Technology Office (MTO) seeks information on suitable and/or commercial microsystem(s) for possible demonstration of dissipated heat to electricity conversion at the chip/substrate/package levels. DARPA is interested in all types of
Entities
DOD
Department of Defense
DARPA(
Defense Advanced Research Projects Agency
NAICS
541715
Set Aside
None
Point of Contact
Full Name Email Phone Type
MTO BAA Coordinator [email protected] None primary
Attachments
  • DARPA-SN-25-70.pdf