Hot Bar Reflow Soldering System
SAM.GOV Due: June 17, 2025 at 09:00 PM UTC
In-Active Combined Synopsis/Solicitation Source Url

Summary

The opportunity for the Hot Bar Reflow Soldering System involves the procurement of specialized soldering equipment to enhance the reliability of soldering connections between flex circuits and rigid circuit boards, particularly for Iridium modem technologies. This initiative is driven by the need to address reliability issues identified during environmental testing, where existing modem connectors failed under cold conditions. The project aims to implement a robust soldering solution that ensures high-performance soldering capabilities in a laboratory setting. Contractors with expertise in manufacturing or supplying advanced soldering systems, particularly those familiar with the requirements of the defense sector, are encouraged to bid on this opportunity.
Description

See Attachments.

Entities
DOD
Department of Defense
DMA(
Defense Microelectronics Activity
NAICS
333992
Set Aside
None
Place of Performance
Broadmoor Vlg , California 95652
Point of Contact
Full Name Email Phone Type
Nicholas S Roberts [email protected] primary
Attachments
  • 25-5D6+SOW+Hot+Bar+Soldering+System.pdf
  • JA+25-5D6_Redacted.pdf
  • Combined+Synopsis+and+Solicitation+SOW+25-5C0.pdf