Maintenance service contract for the FC150 and FC300 flip chip bonders
SAM.GOV Due: June 2, 2025 at 09:00 PM UTC
In-Active Special Notice SBA Source Url

Summary

NASA/NSSC is seeking a contractor to provide a maintenance service contract for the FC150 and FC300 flip chip bonders, which are essential high-precision tools used in the bonding of semiconductor and MEMS devices. The contract will include annual preventative maintenance and emergency service calls, ensuring the reliable operation of these critical systems at the Goddard Space Flight Center in Greenbelt, Maryland. This opportunity is set aside for small businesses, particularly those with experience in providing maintenance services for specialized equipment. Interested contractors should demonstrate their capabilities and qualifications to perform the required services by the specified deadline.
Description

NASA/NSSC has a requirement for maintenance service contract for the FC150 and FC300 flip chip bonders. See the attached SOW and capability statement for further details.

Entities
NAASA
National Aeronautics and Space Administration
NAICS
541990
Set Aside
SBA : Total Small Business Set-Aside (FAR 19.5)
Place of Performance
Greenbelt , Maryland 20771
Point of Contact
Full Name Email Phone Type
Lindsey McLellan [email protected] primary
Attachments
  • Tab+07+Capability+Statement+SAM.pdf
  • Tab+04+SOW.pdf